This Game-Changing Technology Could Help Solve Wi-Fi’s Multi-Decade Problem January 13, 2026 - Baystreet.ca Distributed on behalf of Edgewater Wireless Systems Inc. Wi-Fi is everywhere. It’s in our homes, our offices, our hotels, our hospitals. It’s the invisible backbone of modern life. Unfortunatley, it’s also fundamentally broken, which is creating a massive opportunity for companies such as Edgewater Wireless Systems (TSXV: YFI) (OTC: KPIFF), Qualcomm (NASDAQ: QCOM), Broadcom (NASDAQ: AVGO), Intel (NASDAQ: INTC), and NXP Semiconducotors (NASDAQ: NXPI). Sadly, the Wi-Fi problem goes back 25 years. When Wi-Fi was first designed, a home might have had one or two connected devices. The architecture made sense: a single channel that devices take turns using. It was simple and efficient and good enough for the times. But the world has changed. Today the average home runs 17 or more Wi-Fi devices, all competing for that same single lane. Laptops, phones, tablets, TVs, gaming consoles, smart speakers, security cameras, thermostats, and doorbells. And every new device makes the congestion worse, with Wi-Fi devices operating in a narrow single channel that can lead to congestion and latency. To fix it, companies like Edgewater Wireless Systems patented Spectrum Slicing™ technology divides a traditional single Wi-Fi channel into multiple concurrent links, transforming the congested single-lane road into a multi-lane highway. More lanes mean more devices can transmit simultaneously, which dramatically reduces congestion and cuts latency at the source. Even better, the company’s Wi-Fi breakthrough has proven in the real world – not just in a lab – that it can solve problems the entire Wi-Fi industry has struggled with for decades. Edgewater Wireless Systems (TSXV: YFI) (OTC: KPIFF) is a Wi-Fi Game Changer Edgewater Wireless Systems, the industry pioneer of AI-powered Wi-Fi Spectrum Slicing™ technology for residential, enterprise and Industrial IoT markets, today announced that Wi-Fi semiconductor executive Rick Bahr has joined the Company as a strategic advisor. “Rick is one of the most respected minds in Wi-Fi silicon,” said Brian Imrie, Board Chair of Edgewater Wireless. “From Atheros to Qualcomm to Stanford and Silicon Catalyst, he’s helped define how the world connects over Wi-Fi. His decision to join Edgewater’s advisory team is a powerful validation of our Spectrum Slicing™ vision and our roadmap toward Wi-Fi8-class silicon. We’re thrilled to have his experience and judgment at the table as we move from RF packaging and AI prototyping into full SoC execution.” Bahr is widely recognized for his decades-long leadership in Wi-Fi and processor architecture, having served as Senior Vice President of Engineering at Qualcomm, where he was chartered with driving the company’s Wi-Fi technology roadmap. He joined Qualcomm through its 2011 acquisition of Atheros Communications, the pioneering Wi-Fi chipset company he joined in 2000 to head engineering. “Edgewater is tackling one of Wi-Fi’s hardest problems – how to deliver consistent performance in the most congested of environments – with an elegant, scalable architectural shift,” said Rick Bahr. “Spectrum Slicing™ aligns naturally with where the Wi-Fi8 standard and next-generation access points are headed. I’m excited to support Andrew and the team as they industrialize this technology in silicon, and to help connect Edgewater with the broader semiconductor and system-level innovation I see every day at Stanford and through Silicon Catalyst.” Prior to Atheros and Qualcomm, Bahr held senior engineering leadership roles at SGI, HP, Prime Computer and Apollo, including responsibility for both MIPS® microprocessor and Cray® supercomputer hardware engineering at SGI. Today, Bahr serves as a strategic advisor to Stanford University’s SystemX Alliance in the School of Engineering, where he helps connect leading-edge semiconductor research with real-world applications across computing and wireless systems. He is also a long-standing advisor within the Silicon Catalyst ecosystem, focused on processor architecture, communications, and mentoring the next generation of semiconductor startups. Bahr holds both BSEE and MSEE degrees from MIT. Under his advisory role with Edgewater, Bahr will focus on: · Helping shape the Company’s Wi-Fi8-ready Spectrum Slicing™ silicon roadmap · Guiding system-level architecture decisions across RF front-end, baseband and AI subsystems · Aligning Edgewater’s technology with Tier-1 service provider, industrial IoT and automotive requirements · Providing a bridge between Silicon Catalyst’s global semiconductor ecosystem, Stanford research, and Edgewater’s product and IP-licensing strategy As a Silicon Catalyst company, Edgewater already benefits from access to a global network of semiconductor experts, EDA, foundry and packaging partners, and corporate strategics. Bahr’s appointment deepens that connection, giving Edgewater direct access to one of the ecosystem’s most experienced Wi-Fi and processor-architecture leaders. Other related developments from around the markets include: Qualcomm and Hyundai Mobis announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS). The MOU signing, held at the Hyundai Mobis booth, was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc. Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology. Broadcom announced the launch of its next-generation BCM4918 accelerated processing unit and two new dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719, marking another milestone in its long legacy of Wi-Fi innovation. With the combination of higher throughput plus smart intelligence, Broadcom’s unified Wi-Fi 8 platform allows operators to deliver new real-time agentic applications for residential consumers with built-in security and improved power efficiency. Building on its first-to-market BCM6718 Wi-Fi 8 chipset, Broadcom continues to lead the industry in defining the next generation of wireless performance, intelligence, and efficiency. The new platform combines compute acceleration, advanced networking, and robust security, delivering the high throughput, low latency, and intelligent optimization needed for the emerging AI-driven connected ecosystem. Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States. Powering over 200 designs from leading, global partners, Series 3 will be the most broadly adopted and globally available AI PC platform Intel has ever delivered. “With Series 3, we are laser-focused on improving power efficiency, adding more CPU performance, a bigger GPU in a class of its own, more AI compute and app compatibility you can count on with x86.” – Jim Johnson, Senior Vice President and General Manager, Client Computing Group, Intel. NXP Semiconducotors announced its new eIQ Agentic AI Framework, advancing its leadership in secure, real-time edge AI. This new tool enables autonomous agentic intelligence directly on edge devices, allowing both expert and novice device developers to simplify and accelerate agentic AI development, orchestration and deployment. When combined with NXP’s industry-leading secure edge AI hardware, the eIQ Agentic AI Framework provides a trusted foundation to rapidly prototype and deploy optimized, secure, autonomous AI systems at the edge. As agentic AI becomes essential for next-generation automation, the new eIQ Agentic AI Framework is one of the first solutions to enable agentic AI development at the edge, delivering low-latency performance, built-in security and resilience to accelerate innovation. NXP’s eIQ Agentic AI Framework is designed to eliminate development bottlenecks with deterministic real time decision making and multi model coordination. Powered by the eIQ Agentic AI Framework, edge-based AI agents can instantly control factory equipment when safety risks arise, alert medical staff to urgent conditions, update patient information in real time, or autonomously adjust HVAC systems to mitigate hazards such as fire, all without relying on cloud connectivity. Legal Disclaimer / Except for the historical information presented herein, matters discussed in this article contains forward-looking statements that are subject to certain risks and uncertainties that could cause actual results to differ materially from any future results, performance or achievements expressed or implied by such statements. Winning Media is not registered with any financial or securities regulatory authority and does not provide nor claims to provide investment advice or recommendations to readers of this release. For making specific investment decisions, readers should seek their own advice. Winning Media is only compensated for its services in the form of cash-based compensation. Pursuant to an agreement Winning Media has been paid three thousand five hundred dollars for advertising and marketing services for Edgewater Wireless Systems Inc. by Edgewater Wireless Systems Inc. We own ZERO shares of Edgewater Wireless Systems Inc. Please click here for full disclaimer. Contact Information: Ty Hoffer Winning Media 281.804.7972 [email protected]
This Game-Changing Technology Could Help Solve Wi-Fi’s Multi-Decade Problem January 13, 2026 - Baystreet.ca Distributed on behalf of Edgewater Wireless Systems Inc. Wi-Fi is everywhere. It’s in our homes, our offices, our hotels, our hospitals. It’s the invisible backbone of modern life. Unfortunatley, it’s also fundamentally broken, which is creating a massive opportunity for companies such as Edgewater Wireless Systems (TSXV: YFI) (OTC: KPIFF), Qualcomm (NASDAQ: QCOM), Broadcom (NASDAQ: AVGO), Intel (NASDAQ: INTC), and NXP Semiconducotors (NASDAQ: NXPI). Sadly, the Wi-Fi problem goes back 25 years. When Wi-Fi was first designed, a home might have had one or two connected devices. The architecture made sense: a single channel that devices take turns using. It was simple and efficient and good enough for the times. But the world has changed. Today the average home runs 17 or more Wi-Fi devices, all competing for that same single lane. Laptops, phones, tablets, TVs, gaming consoles, smart speakers, security cameras, thermostats, and doorbells. And every new device makes the congestion worse, with Wi-Fi devices operating in a narrow single channel that can lead to congestion and latency. To fix it, companies like Edgewater Wireless Systems patented Spectrum Slicing™ technology divides a traditional single Wi-Fi channel into multiple concurrent links, transforming the congested single-lane road into a multi-lane highway. More lanes mean more devices can transmit simultaneously, which dramatically reduces congestion and cuts latency at the source. Even better, the company’s Wi-Fi breakthrough has proven in the real world – not just in a lab – that it can solve problems the entire Wi-Fi industry has struggled with for decades. Edgewater Wireless Systems (TSXV: YFI) (OTC: KPIFF) is a Wi-Fi Game Changer Edgewater Wireless Systems, the industry pioneer of AI-powered Wi-Fi Spectrum Slicing™ technology for residential, enterprise and Industrial IoT markets, today announced that Wi-Fi semiconductor executive Rick Bahr has joined the Company as a strategic advisor. “Rick is one of the most respected minds in Wi-Fi silicon,” said Brian Imrie, Board Chair of Edgewater Wireless. “From Atheros to Qualcomm to Stanford and Silicon Catalyst, he’s helped define how the world connects over Wi-Fi. His decision to join Edgewater’s advisory team is a powerful validation of our Spectrum Slicing™ vision and our roadmap toward Wi-Fi8-class silicon. We’re thrilled to have his experience and judgment at the table as we move from RF packaging and AI prototyping into full SoC execution.” Bahr is widely recognized for his decades-long leadership in Wi-Fi and processor architecture, having served as Senior Vice President of Engineering at Qualcomm, where he was chartered with driving the company’s Wi-Fi technology roadmap. He joined Qualcomm through its 2011 acquisition of Atheros Communications, the pioneering Wi-Fi chipset company he joined in 2000 to head engineering. “Edgewater is tackling one of Wi-Fi’s hardest problems – how to deliver consistent performance in the most congested of environments – with an elegant, scalable architectural shift,” said Rick Bahr. “Spectrum Slicing™ aligns naturally with where the Wi-Fi8 standard and next-generation access points are headed. I’m excited to support Andrew and the team as they industrialize this technology in silicon, and to help connect Edgewater with the broader semiconductor and system-level innovation I see every day at Stanford and through Silicon Catalyst.” Prior to Atheros and Qualcomm, Bahr held senior engineering leadership roles at SGI, HP, Prime Computer and Apollo, including responsibility for both MIPS® microprocessor and Cray® supercomputer hardware engineering at SGI. Today, Bahr serves as a strategic advisor to Stanford University’s SystemX Alliance in the School of Engineering, where he helps connect leading-edge semiconductor research with real-world applications across computing and wireless systems. He is also a long-standing advisor within the Silicon Catalyst ecosystem, focused on processor architecture, communications, and mentoring the next generation of semiconductor startups. Bahr holds both BSEE and MSEE degrees from MIT. Under his advisory role with Edgewater, Bahr will focus on: · Helping shape the Company’s Wi-Fi8-ready Spectrum Slicing™ silicon roadmap · Guiding system-level architecture decisions across RF front-end, baseband and AI subsystems · Aligning Edgewater’s technology with Tier-1 service provider, industrial IoT and automotive requirements · Providing a bridge between Silicon Catalyst’s global semiconductor ecosystem, Stanford research, and Edgewater’s product and IP-licensing strategy As a Silicon Catalyst company, Edgewater already benefits from access to a global network of semiconductor experts, EDA, foundry and packaging partners, and corporate strategics. Bahr’s appointment deepens that connection, giving Edgewater direct access to one of the ecosystem’s most experienced Wi-Fi and processor-architecture leaders. Other related developments from around the markets include: Qualcomm and Hyundai Mobis announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS). The MOU signing, held at the Hyundai Mobis booth, was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc. Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology. Broadcom announced the launch of its next-generation BCM4918 accelerated processing unit and two new dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719, marking another milestone in its long legacy of Wi-Fi innovation. With the combination of higher throughput plus smart intelligence, Broadcom’s unified Wi-Fi 8 platform allows operators to deliver new real-time agentic applications for residential consumers with built-in security and improved power efficiency. Building on its first-to-market BCM6718 Wi-Fi 8 chipset, Broadcom continues to lead the industry in defining the next generation of wireless performance, intelligence, and efficiency. The new platform combines compute acceleration, advanced networking, and robust security, delivering the high throughput, low latency, and intelligent optimization needed for the emerging AI-driven connected ecosystem. Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United States. Powering over 200 designs from leading, global partners, Series 3 will be the most broadly adopted and globally available AI PC platform Intel has ever delivered. “With Series 3, we are laser-focused on improving power efficiency, adding more CPU performance, a bigger GPU in a class of its own, more AI compute and app compatibility you can count on with x86.” – Jim Johnson, Senior Vice President and General Manager, Client Computing Group, Intel. NXP Semiconducotors announced its new eIQ Agentic AI Framework, advancing its leadership in secure, real-time edge AI. This new tool enables autonomous agentic intelligence directly on edge devices, allowing both expert and novice device developers to simplify and accelerate agentic AI development, orchestration and deployment. When combined with NXP’s industry-leading secure edge AI hardware, the eIQ Agentic AI Framework provides a trusted foundation to rapidly prototype and deploy optimized, secure, autonomous AI systems at the edge. As agentic AI becomes essential for next-generation automation, the new eIQ Agentic AI Framework is one of the first solutions to enable agentic AI development at the edge, delivering low-latency performance, built-in security and resilience to accelerate innovation. NXP’s eIQ Agentic AI Framework is designed to eliminate development bottlenecks with deterministic real time decision making and multi model coordination. Powered by the eIQ Agentic AI Framework, edge-based AI agents can instantly control factory equipment when safety risks arise, alert medical staff to urgent conditions, update patient information in real time, or autonomously adjust HVAC systems to mitigate hazards such as fire, all without relying on cloud connectivity. Legal Disclaimer / Except for the historical information presented herein, matters discussed in this article contains forward-looking statements that are subject to certain risks and uncertainties that could cause actual results to differ materially from any future results, performance or achievements expressed or implied by such statements. Winning Media is not registered with any financial or securities regulatory authority and does not provide nor claims to provide investment advice or recommendations to readers of this release. For making specific investment decisions, readers should seek their own advice. Winning Media is only compensated for its services in the form of cash-based compensation. Pursuant to an agreement Winning Media has been paid three thousand five hundred dollars for advertising and marketing services for Edgewater Wireless Systems Inc. by Edgewater Wireless Systems Inc. We own ZERO shares of Edgewater Wireless Systems Inc. Please click here for full disclaimer. Contact Information: Ty Hoffer Winning Media 281.804.7972 [email protected]